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이시목Simok Lee
KAIST
Sci. Adv., May 30 2025, 11 (22) eadv4921 | https://doi.org/10.1126/sciadv.adv4921
Phase-change metal ink with pH-controlled chemical sintering for versatile and scalable fabrication of variable stiffness electronics
Simok Lee 1 †, Gun-Hee Lee 2 3 †, Inho Kang 1, Woojin Jeon 2, Semin Kim 4, Yejin Ahn 1, Choong Yeon Kim 1 5, Do A Kwon 6 7, Michael D Dickey 8, Steve Park 9 10 *, Seongjun Park 2 11 12 13 14 *, Jae-Woong Jeong 1 4 10 15 *
1School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea.
2Medical Research Center, Seoul National University, Seoul 03080, Republic of Korea.
3Departments of Cogno-Mechatronics Engineering and Optics and Mechatronics Engineering, Pusan National University, Busan 46241, Republic of Korea.
4Graduate School of Semiconductor Technology, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea.
5KAIST Information and Electronics Research Institute, Daejeon 34141, Republic of Korea.
6Research Laboratory of Electronics, Massachusetts Institute of Technology (MIT), Cambridge, MA 02139, USA.
7Department of Mechanical Engineering, Massachusetts Institute of Technology (MIT), Cambridge, MA 02139, USA.
8Department of Chemical and Biomolecular Engineering, North Carolina State University (NCSU), Raleigh, NC 27606, USA.
9Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea.
10KAIST Institute for NanoCentury, Daejeon 34141, Republic of Korea.
11Department of Biomedical Sciences, College of Medicine, Seoul National University, Seoul 03080, Republic of Korea.
12School of Transdisciplinary Innovations, Seoul National University, Seoul 03080, Republic of Korea.
13Interdisciplinary Program in Bioengineering, College of Engineering, Seoul National University, Seoul 08826, Republic of Korea.
14Department of Transdisciplinary Medicine, Seoul National University Hospital, Seoul 03080, Republic of Korea.
15KAIST Institute for Health Science and Technology, Daejeon 34141, Republic of Korea.
2Medical Research Center, Seoul National University, Seoul 03080, Republic of Korea.
3Departments of Cogno-Mechatronics Engineering and Optics and Mechatronics Engineering, Pusan National University, Busan 46241, Republic of Korea.
4Graduate School of Semiconductor Technology, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea.
5KAIST Information and Electronics Research Institute, Daejeon 34141, Republic of Korea.
6Research Laboratory of Electronics, Massachusetts Institute of Technology (MIT), Cambridge, MA 02139, USA.
7Department of Mechanical Engineering, Massachusetts Institute of Technology (MIT), Cambridge, MA 02139, USA.
8Department of Chemical and Biomolecular Engineering, North Carolina State University (NCSU), Raleigh, NC 27606, USA.
9Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea.
10KAIST Institute for NanoCentury, Daejeon 34141, Republic of Korea.
11Department of Biomedical Sciences, College of Medicine, Seoul National University, Seoul 03080, Republic of Korea.
12School of Transdisciplinary Innovations, Seoul National University, Seoul 03080, Republic of Korea.
13Interdisciplinary Program in Bioengineering, College of Engineering, Seoul National University, Seoul 08826, Republic of Korea.
14Department of Transdisciplinary Medicine, Seoul National University Hospital, Seoul 03080, Republic of Korea.
15KAIST Institute for Health Science and Technology, Daejeon 34141, Republic of Korea.
†These authors contributed equally
*Corresponding authors: correspondence to Steve Park, Seongjun Park or Jae-Woong Jeong
*Corresponding authors: correspondence to Steve Park, Seongjun Park or Jae-Woong Jeong
Abstract
Variable stiffness electronics represent the forefront of adaptive technology, integrating rigid and soft electronics in a single system through dynamic mechanical modulation. While gallium's high modulus tuning ratio and rapid phase transitions make it ideal for transformative electronic systems (TES), its liquid-state instability, high surface tension, and unintended phase transitions during processing pose substantial challenges. Here, we introduce STiffness-Adjustable temperature-Responsive ink (STAR ink), a chemically sinterable gallium composite electronic ink designed to overcome these obstacles. STAR ink enables high-resolution (~50 micrometers) circuit patterning, large-scale batch fabrication, and three-dimensional structure coating at room temperature. Through pH-controlled chemical sintering, STAR ink-based TES exhibits exceptional mechanical tunability (tuning ratio: 1465) and electrical conductivity (2.27 × 106 siemens per meter). Demonstrated applications-from multilayered variable stiffness printed circuit boards (PCBs) matching standard PCBs' complexity to body-temperature responsive neural probe-underscore STAR ink's potential for reconfigurable electronics across consumer electronics and biomedical devices.
논문정보
- Research article
- 2025년 05월 (BRIC 등록일 2025-06-02)
- 국내(교신)+국외 연구진
- 바이오·의료융합 > 다학제 융합/복합
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