Hyeonseok Han 1, Hyunwoo Park 2, Seokjoo Cho 1, Sung-Uk Lee 3, Jungrak Choi 4, Ji-Hwan Ha 1, Jaeho Park 1, Young Jung 5, Hyunjin Kim 1, Junseong Ahn 6, Yeong Jae Kwon 1, Yong Suk Oh 7, Minkyu Je 2, Inkyu Park 1
1Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 34141, Republic of Korea.
2School of Electrical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, 34141, Republic of Korea.
3Advanced 3D Printing Technology Development Division, Korea Atomic Energy Research Institute, Daejeon, 34057, Republic of Korea.
4Electronics and Telecommunications Research Institute (ETRI), Daejeon, 34129, Republic of Korea.
5Department of Mechanical Engineering, Pukyong National University, Busan, 48513, Republic of Korea.
6Department of Electro-Mechanical Systems Engineering, Korea University, Sejong, 30019, Republic of Korea.
7Department of Mechanical Engineering, Changwon National University, Changwon, 51140, Republic of Korea.
H.H., H.P., and S.C. contributed equally to this work.
Corresponding Authors: Yong Suk Oh, Minkyu Je, Inkyu Park