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조회191

National University of Singapore (NUS)

Adv. Funct. Mater., Volume34, Issue37 September 11, 2024 2402144 | https://doi.org/10.1002/adfm.202402144 Thermal Interface Hydrogel Composites Mechanically Compliant with Curvy Skins and Rigid Electronic Modules

Donghwan Ji¹, Paiting Liu², Pilseon Im¹, Sunmi Shin,2^* and Jaeyun Kim^1,3,4,5*

¹School of Chemical Engineering, Sungkyunkwan University (SKKU), Suwon, 16419 Republic of Korea
²Department of Mechanical Engineering, National University of Singapore (NUS), Singapore, 117575 Singapore
³Department of Health Sciences and Technology, Samsung Advanced Institute for Health Sciences & Technology (SAIHST), Sungkyunkwan University (SKKU), Suwon, 16419 Republic of Korea
⁴Biomedical Institute for Convergence at SKKU (BICS), Sungkyunkwan University (SKKU), Suwon, 16419 Republic of Korea
⁵Institute of Quantum Biophysics (IQB), Sungkyunkwan University (SKKU), Suwon, 16419 Republic of Korea

D.J. and P.L. authors contributed equally to this work.
Corresponding Authors: Sunmi Shin, Jaeyun Kim

Abstract

The evolution of wearable electronic devices has drawn attention to personal thermal management (PTM) technologies encompassing the sensing and regulation of body temperature and/or harnessing human body heat for energy harvesting. However, solid PTM devices encounter inherent limitations concerning thermal contact and mechanical compatibility with the human body. This study introduces a thermal interface hydrogel exhibiting high thermal conduction and mechanical compatibility with human skin. Employing a strategic design approach, the mechanical and thermal properties of the hydrogel are assessed. This hydrogel is a structured composite incorporating alumina microplatelets embedded layer-by-layer within a densified polymer matrix. Incorporating aligned alumina platelets in the layered structure, combined with a densified polymer matrix ensuring close contact and packing of polymer chains, enhances the thermal conductivity of the hydrogel. Simultaneously, it maintains mechanical flexibility and robustness. Subsequently, the resulting hydrogel is showcased as a thermal interface material sandwiched between flexible human skin and a rigid Peltier module for a cooling device affixed to the human skin. Anticipated applications of the hydrogel-based thermal interface material include advanced bioelectronics with added functionalities in PTM, all without inducing mechanical or physical discomfort.

논문정보

형식Research article
게재일2024년 09월 (BRIC 등록일 2024-12-12)
연구진국내(교신)+국외 연구진
분야 바이오·의료융합 > 바이오센싱 및 나노바이오물질

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