한빛사논문
Gun-Hee Lee1,2,3,9, Do Hoon Lee1,9, Woojin Jeon3,9, Jihwan Yoon4, Kwangguk Ahn4, Kum Seok Nam3, Min Kim1, Jun Kyu Kim1, Yong Hoe Koo5, Jinmyoung Joo5, WooChul Jung1, Jaehong Lee6, Jaewook Nam4, Seongjun Park3,7,8, Jae-Woong Jeong2,7 & Steve Park1,7,8
1Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea.
2School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea.
3Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseonggu, Daejeon 34141, Republic of Korea.
4School of Chemical and Biological Engineering, Institute of Chemical Processes, Seoul National University, 599 Gwanak-ro, Gwanak-gu, Seoul 08826, Republic of Korea.
5Department of Biomedical Engineering, Ulsan National Institute of Science and Technology(UNIST), 50, UNIST-gil, Ulju-gun, Ulsan 44919, Republic of Korea.
6Department of Robotics and Mechatronics Engineering, Daegu Gyeongbuk Institute of Science and Technology (DGIST), 333 Techno Jungang-daero, Daegu 42988, Republic of Korea.
7KAIST Institute for Health Science and Technology, 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea.
8KAIST Institute for NanoCentury, 291 Daehak-ro, Yuseong-gu, Daejeon 34141, Republic of Korea.
9These authors contributed equally: Gun-Hee Lee, Do Hoon Lee, Woojin Jeon.
Corresponding authors : Correspondence to Seongjun Park, Jae-Woong Jeong or Steve Park.
Abstract
Deformable semi-solid liquid metal particles (LMP) have emerged as a promising substitute for rigid conductive fillers due to their excellent electrical properties and stable conductance under strain. However, achieving a compact and robust coating of LMP on fibers remains a persistent challenge, mainly due to the incompatibility of conventional coating techniques with LMP. Additionally, the limited durability and absence of initial electrical conductivity of LMP restrict their widespread application. In this study, we propose a solution process that robustly and compactly assembles mechanically durable and initially conductive LMP on fibers. Specifically, we present a shearing-based deposition of polymer-attached LMP followed by additional coating with CNT-attached LMP to create bi-layer LMP composite with exceptional durability, electrical conductivity, stretchability, and biocompatibility on various fibers. The versatility and reliability of this manufacturing strategy for 1D electronics are demonstrated through the development of sewn electrical circuits, smart clothes, stretchable biointerfaced fiber, and multifunctional fiber probes.
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